BGA soldering for special products requires precise adherence to the recommended thermal profile. In the IR-650 PRO, thermal profiling
is ensured by automatic temperature correction of all heaters by means of temperature feedback from a sensor,
installed on the printed circuit board in the BGA soldering zone.
The IR station is equipped with vacuum tweezers and air cooler for PCBs. IR-650 PRO provides automatic soldering of any microchips installed at any point of the printed circuit board, while the size and configuration of the board play virtually no role.
configuration of the board practically do not play any role. It is estimated that since 2008 more than 2,500,000 BGA packages have been soldered on the IR-650 PRO stations.
pieces of BGA packages.
PLIS, DSP, CPU, GPU, memory - all these components in BGA packages can be easily installed on a multilayer printed assembly of class 5
with internal thermoconductive layers of copper of increased thickness, using infrared soldering station IK-650 PRO.
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