The vacuum sputtering unit UVN-74P-3M-2 is designed for double-sided deposition of metal films of copper or aluminium with a chromium sublayer on polycor and sitalloy substrates by magnetron vacuum sputtering in the production of hybrid-film microcircuits.
Electrical power supply of magnetrons is unipolar.
Maximum number of substrates of 60x48x(0,5...1,0) mm size 40 pcs. to be processed simultaneously.
Sputtering of the adhesion layer of chromium is carried out by control of the set resistance of the layer on the witness.
Sputtering of the conductive layer of the film is carried out according to the set time.
The time of achieving residual pressure of 4 x 10-4 Pa in the working chamber after opening the high-vacuum shutter is not more than 80 min.
The unit provides:
-regulation of the rotation speed of the drum with substrates in the range from 10 to 60 rpm.
-heating of the drum up to 300 °C.
-control of resistance of the witness of film sputtering on the substrates in the range from 0 to 25 kOhm.
-power of the ion source up to 200 W.
-power...
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