Lower heating of large-sized boards with the possibility of soldering according to the thermal profile, with temperature control in numerical and graphical form - a solution for gentle and uniform heating of printed circuit boards during production and repair.
is the solution for gentle and uniform heating of printed circuit boards during production and repair. They can also be used for thermal profile reflow soldering in single or small batch production of printed circuit boards.
production of printed circuit assemblies. Thermo tables for industrial applications - sturdy steel housing, effective thermal insulation, control unit in a separate housing, stability of technical characteristics - all this is evidence of reliability of the product, designed for a service life of more than 8 years.
Soldering and bottom heating on the thermal profile - thermal tables provide automatic soldering of printed circuit boards by melting solder paste on the thermal profile with the formation of a cooling zone. Soldering is carried out by contact method with placing the board directly on the working surface of the thermal table.
Normalised uniformity of the heater temperature field - provides heating with minimal deformation of both thin and massive printed circuit boards.
Possibility to work with any materials - processing of boards made of glass-textolite, aluminium, polyimide, polycor, ceramics, microwave materials such as FLAN, BRICOR, ROGERS, NELCO.
Ability to work with any components - processing of boards mounted on heat sinks or in aluminium cases, as well as boards with BGA, CSP, QFP, QFN, TSOP, PLCC chips and Glob Top components.
High power density and efficient thermal protection - ensures that boards are heated in a targeted manner and reach operating temperature quickly.
Anti-static protection - all requirements are met to prevent sensitive components from being damaged by electrostatic discharges.
Built-in hardware and software automation - ensure safe operation of the equipment.
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