Highly thermally conductive dielectric gasket material based on special fillers (TP-6) with thermal conductivity coefficient not less than 5,0W/(mK) is designed for heat dissipation from heated elements in electronic equipment, radio engineering and instrumentation.</it id=409580>It is a silicone gasket 0,5-3,0 mm thick, obtained by curing of silicone binder filled with highly thermally conductive fillers. It is supplied in the form of 230x230 mm plates
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