Group processing of substrates in one technological cycle: Ø 76 mm - 15 pcs; Ø 100 mm - 9 pcs; Ø 150 mm - 3 pcs.
Sluice chamber for loading and unloading of wafers (Item 1);
System of transfer of wafers from the lock chamber to two working positions (2, 3) by transport carousel;
Multicathode MRU with three Ø100 mm targets;
Four-tigel electron beam evaporator;
Substrate preheating and cleaning with ion source;
Oil-free (dry) pumping based on forevacuum and turumolecular or cryogenic pumps;
Microprocessor control system;
Consumption power not more than 20 kW;
Area occupied by one unit ~ 6m2
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