Purpose: application of multilayer thin-film coatings by ion-beam sputtering and possibility of substrate heating.
Features:
- Dual-chamber design - the substrate holder is loaded in the airlock chamber, then, after high-vacuum pumping, it is transported by means of a linear movement mechanism to the process chamber where the materials are deposited.
- Independent pumping systems for the process and airlock vacuum chambers.
- The installation involves the use of metallic and dielectric target materials (Ti, Ta, Nb, Zr, Hf, Al, Si and their oxide compounds) with an influx of working gases (Ar, Xe, Kr, N2, O2).
- Material deposition takes place on substrates fixed on a disc substrate holder.
- Oil-free vacuum pumping.
- Coating in manual and automatic modes.
- Automatic process logging.
- Dual touch screen control, etc.
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