Highly thermally conductive dielectric gasket material based on special fillers (TP-4) with thermal conductivity coefficient not less than 3W/(mK) is designed for heat dissipation from heated elements in electronic equipment, radio engineering and instrumentation.It is a silicone gasket 1,5-4,0 mm thick, obtained by curing of silicone binder filled with thermally conductive fillers. It is supplied in the form of 230x230 mm plates.
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